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 CYStech Electronics Corp.
Schottky barrier diode
Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 1/3
RB491DN3
Description
Planar silicon Schottky barrier diode encapsulated in a SOT-23 plastic SMD package.
Features
*Small surface mounting type SOT-23 *Ultra low VF(VF=0.4V typ at 1A) *IF=1A guaranteed despite the size
Applications
*Low power rectification *For switching power supply
Symbol
RB491DN3
Outline
SOT-23
Cathode
2
1
3
1. Anode 2. Not Connected 3. Cathode
Anode
Not Connected
Absolute Maximum Ratings (Ta=25C)
Parameter Peak reverse voltage DC reverse voltage DC forward current Peak forward surge current * Junction temperature Storage temperature * 60 Hz for 1 cycle Symbol VRM VR IF IFSM Tj Tstg Limits 25 20 1 3 125 -40~+125 Unit V V A A C C
RB491DN3
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristics (Ta=25C)
Parameter Forward Voltage Reverse Current Symbol VF IR IF=1A VR=20V Condition Min. -
Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 2/3
Typ -
Max. 0.45 200
Unit V A
Note:ESD sensitive product handling required
RB491DN3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 3/3
Marking:
A L 3 B 1 2 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style:Pin.1. Anode 2. Not Connected 3.Cathode D K S
10T TE
V
G
C
H
J
*: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB491DN3
CYStek Product Specification


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